丛明, 杜宇, 沈宝宏, 金立刚. 面向IC制造的硅片机器人传输系统综述[J]. 机器人, 2007, 29(3): 261-266.
引用本文: 丛明, 杜宇, 沈宝宏, 金立刚. 面向IC制造的硅片机器人传输系统综述[J]. 机器人, 2007, 29(3): 261-266.
CONG Ming, DU Yu, SHEN Bao-hong, JIN Li-gang. Robotic Wafer Handling Systems for Integrated Circuit Manufacturing: A Review[J]. ROBOT, 2007, 29(3): 261-266.
Citation: CONG Ming, DU Yu, SHEN Bao-hong, JIN Li-gang. Robotic Wafer Handling Systems for Integrated Circuit Manufacturing: A Review[J]. ROBOT, 2007, 29(3): 261-266.

面向IC制造的硅片机器人传输系统综述

Robotic Wafer Handling Systems for Integrated Circuit Manufacturing: A Review

  • 摘要: 介绍了面向集成电路制造业的硅片机器人传输系统,综述了其主要组成部分——硅片机器人和预对准装置——的工作原理及国内外研究成果.就直接驱动技术、磁性流体密封技术、磁力传动技术、硅片机器人轨迹规划与控制技术、校准技术以及夹持技术,对硅片机器人传输系统的关键技术进行了探讨.

     

    Abstract: This paper surveys robotic wafer handling system for integrate circuit manufacturing,and reviews the operating principle and research results of the main components of the system,i.e.,wafer robot and prealigner.It also discusses the key technologies of robotic wafer handling system,including direct drive,magnetic fluid seals,magnetic coupling,tra-jectory planning,control technology,calibration and gripping.

     

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