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| Robotic Wafer Handling Systems for Integrated Circuit Manufacturing: A Review |
| CONG Ming, DU Yu, SHEN Bao-hong, JIN Li-gang |
| Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China |
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Abstract This paper surveys robotic wafer handling system for integrate circuit manufacturing,and reviews the operating principle and research results of the main components of the system,i.e.,wafer robot and prealigner.It also discusses the key technologies of robotic wafer handling system,including direct drive,magnetic fluid seals,magnetic coupling,tra-jectory planning,control technology,calibration and gripping.
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Received: 10 August 2006
Published: 15 May 2007
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