CONG Ming, DU Yu, SHEN Bao-hong, JIN Li-gang. Robotic Wafer Handling Systems for Integrated Circuit Manufacturing: A Review[J]. ROBOT, 2007, 29(3): 261-266.
Citation: CONG Ming, DU Yu, SHEN Bao-hong, JIN Li-gang. Robotic Wafer Handling Systems for Integrated Circuit Manufacturing: A Review[J]. ROBOT, 2007, 29(3): 261-266.

Robotic Wafer Handling Systems for Integrated Circuit Manufacturing: A Review

  • This paper surveys robotic wafer handling system for integrate circuit manufacturing,and reviews the operating principle and research results of the main components of the system,i.e.,wafer robot and prealigner.It also discusses the key technologies of robotic wafer handling system,including direct drive,magnetic fluid seals,magnetic coupling,tra-jectory planning,control technology,calibration and gripping.
  • loading

Catalog

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return